ResinLab thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler, reducing physical stresses during thermal cycling. We maximize thermal conductivity by using a unique distribution of particles allowing for the highest filler content, while maintaining relatively low viscosity.
For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.
| Product | Color | Viscosity (cps) | Pot Life | Hardness (Shore D) | Specific Gravity | Shear Strength (psi) | Temperature Range | Tk (W/m.K) |
|---|---|---|---|---|---|---|---|---|
| EP1200 Black | Black | 36,000 | 23min | 75 | 1.98 | 1,600 | -40 - 150 °C | 0.6 |
| EP1200LV Black | Black | 25,000 | 15 - 20min | 70 | 1.61 | 1,100 | -40 - 150 °C | 0.4 |
| EP1285 Black | Black | 8,000 - 120,000 | Varies | 90 | 2.27 | 900 - 2,700 | Varies | 0.8 to 1.2 |
| EP1350 Black | Black | 6,000 | 12 - 16h | 90 | 1.97 | - | -55 - 230 °C | 0.7 |
Contact an experienced representative for more information on ResinLab thermally conductive encapsulants or request a quote.