EP965 CLEAR - A QT
ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.
| SDS | EP965 Part A |
| SDS | EP965 Part B |
| TDS | EP965 A/B |
| Size | Part # | ||
|---|---|---|---|
| 1 qt | EP965 CLEAR - A QT | Request a Quote | Buy Now |
| 1 gal | EP965 CLEAR - A GL | Request a Quote | Buy Now |
| 5 gal | EP965 CLEAR - A PL | Request a Quote | Buy Now |
| 1 qt | EP965 CLEAR - B QT | Request a Quote | Buy Now |
| 1 gal | EP965 CLEAR - B GL | Request a Quote | Buy Now |
| 5 gal | EP965 CLEAR - B PL | Request a Quote | Buy Now |
| 50 mL | EP965 CLEAR 50ML | Request a Quote | Buy Now |
Additional sizes and custom packaging solutions available. Learn more