EP1330 GL
ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties.
| SDS | EP1330 |
| TDS | EP1330 |
| Brochure | Electronic Applications |
| Size | Part # | ||
|---|---|---|---|
| 1 gal | EP1330 GL | Request a Quote |
Additional sizes and custom packaging solutions available. Learn more