EP1026T3 50ML
ResinLab EP1026T3 is a two component, room and elevated temperature curing, unfilled, epoxy adhesive paste that is used for rapid bonding of plastics, metal, and ceramics. It is semi-rigid, non-sagging, and resistant to salt spray, water, organic, and inorganic solvents. 1:1 mix ratio.
SDS | EP1026T3 Part A |
SDS | EP1026T3 Part B |
TDS | EP1026T3 A/B |
Size | Part # | ||
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50 mL | EP1026T3 50ML | Request a Quote | Buy Now |
Additional sizes and custom packaging solutions available. Learn more