ResinLab SEC1244 is a silver-filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth, 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. Features a very high thermal conductivity due to its high loading of pure silver.
For sizes and pricing please contact a ResinLab representative.
| SDS | SEC1244 Part A |
| SDS | SEC1244 Part B |
| TDS | SEC1244 A/B |
| Brochure | Electronic Applications |
Additional sizes and custom packaging solutions available. Learn more