ResinLab's thermally conductive encapsulants are designed to help dissipate heat from sensitive electronic components to extend the life span of devices. Most standard systems contain aluminum oxide filler which also reduces the CTE, reducing physical stresses during thermal cycling. We maximize thermal conductivity by using a unique distribution of particles allowing for the highest filler content, while maintaining relatively low viscosity. EP 1200 is a unique product by being a friendly 1/1 volume ratio and quite stable in side-by-side dispensing cartridges. For even higher performance, we offer a range of custom resin systems containing fillers such as boron nitride and aluminum nitride.

Check out our full line of UL Rated, ANSI/UL 94 compliant Encapsulants - several UL 94V0 formulas.

  • EP1200 BLACK

    Product Documents

    Highly filled, medium viscosity thermally conductive epoxy encapsulant. Cures to a soft flexible polymer with a low CTE and shrinkage.

    Mixed Viscosity Pot Life Shore Hardness Mix Ratio Temperature Range
    30,000 cps 120-150 minutes 75 D 1/1 volume -40 to 150°C
  • EP1200LV BLACK

    Product Documents

    Moderately filled, very low viscosity thermally conductive epoxy encapsulant. Cures to a soft flexible polymer with a low CTE and shrinkage.

    Mixed Viscosity Pot Life Shore Hardness Mix Ratio Temperature Range
    12,000 cps 120-150 minutes 65 D 1/1 volume -40 to 150°C
  • EP1285 BLACK

    Product Documents

    Very highly filled, medium viscosity thermally conductive epoxy encapsulant. Cures to a rigid high modulus polymer with a low CTE and shrinkage. Available with various hardeners for a choice of viscosities, cure speed and temperature resistance.

    Mixed Viscosity Pot Life Shore Hardness Mix Ratio Temperature Range
    Varies Varies 90-95 D Varies with catalyst Varies with catalyst