One part heat cure highly filled, non sag viscosity thermally conductive epoxy adhesive. Cures quickly to a rigid high modulus polymer with a low CTE and shrinkage.
ResinLab EP1330 is a one part heat cure epoxy polymer system. It can also be used as a small mass potting or staking compound, or a dam adhesive in a "dam and fill" application, or general polymer system where the application requires high thermal conductivity, low shrinkage, and low CTE. 0.1 gal cartridge.
EP1330 1/10 GL