One part heat cure filled conformal coating or small mass potting system. Excellent adhesion to FR-4, low shrinkage and stress on components upon cure.
ResinLab EP1325 is a one part thixotropic, heat curing epoxy adhesives. It can also be used as a small mass potting compound, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. 55 cc syringe.