ResinLab offers a line of RoHS compliant stock and custom silver filled electrically conductive adhesives which provide electrical pathways for applications which cannot withstand the heat of solder. Typical applications are disk drive, flip-chip and die attach assembly. Most systems are available as two part mix-in format or pre-mixed and frozen. Some systems are suitable for using the DS-4 dual syringe.

  • SEC1222

    Product Documents

    Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and good temperature resistance.

    Mixed ViscosityViscosityPot LifeShore HardnessMix RatioTemperature Range
    318,500 318,500 45 minutes 80D 1/1 volume -40° to 150°C
  • SEC1233

    Product Documents

    Highly silver filled electrically conductive epoxy adhesive. Room temperature cure with high strength and excellent flexibility. Suitable for use in DS-4 dual syringe.

    Mixed ViscosityViscosityPot LifeShore HardnessMix RatioTemperature Range
    Light paste 172,000 1 hour 50D 1/1 volume -40° to 150°C
  • SEC1244

    Product Documents

    Highly silver filled electrically conductive epoxy adhesive. High temperature snap cure with high strength and excellent temperature resistance and stability.

    Mixed ViscosityViscosityPot LifeShore HardnessMix RatioTemperature Range
    Light paste 234,000 >24 hours 80D 1/1 volume -40° to 180°C